ZIW 2019 Agenda

Class Level Legend:
All Levels, Beginner, IntermediateAdvanced

Start Time TRACK A TRACK B TRACK C TRACK D
4/15/19
5:00 – 6:30 PM Welcome Reception
04/16/19 Harness and Panel Design Harness and Panel Design PCB and IC Packaging Design Digital Engineering
8:00 AM General Session
9:45 AM

E3.series 2019 Highlights

Instructor: Bernd Schlenk

Year after year an amazing team of E3.series developers, product managers and supporting staff put their heart and soul into improving the value added by E3.series to the engineering community. The design experience, automation, groundbreaking workflows, and new paradigms are all part of the what’s new class prepared for you.

Join us for this Christmas-morning-coming-in-the-middle-of-spring class and get a first look at the highlights of E3.series 2019 – a class full of productivity and possibilities.

CR-8000 2019 Highlights

Instructor: Steve Watt

This is always a highly anticipated session with the introduction of the latest CR-8000 release. As a Zuken flagship product, you can imagine the thought, discussion, decisions and sweat that went into this annual release. Please join us as we take you on the CR-8000 2019 release journey beginning with the release theme and culminating in a set of release highlights that address evolving design methodologies and new technologies.

10:45 AM

Programming with .NET in E3.series

Instructor: Tyler Smith

Automation and programming are strong drivers of productivity for E3.series users with the vast and open API cited as one of the major factors in their success. The API is ever growing with more avenues for automation being added at a breakneck pace. The addition of plugins has opened up a new world of possibilities for
users to create inspiring solutions.

This class will present the basic building blocks and introduce the steps involved in creating a simple plugin using VB.net and C# inside E3.series. We will also discuss the new and improved methodologies keeping in step with the latest programming technologies available with E3.series

E3.series Design Reuse with DS-E3

Instructor: Yoshihiro Yokoyama

Engineering data management has been one of the roadblocks to attaining end-to-end product data management. Work-in-progress engineering data is complex and changing without a moment’s notice. The traditional business data management systems struggle to find a viable solution that is effective throughout the design to manufacturing process. Zuken’s DS-E3 solution is directly targeted at demystifying engineering data throughout the design phase to enable effective interactions with various business systems.

In this class, along with an overview of the DS-E3 solution and recent updates, we will address important design process challenges such as reusing sub-sections of a project among multiple E3.series projects and avoiding rework. These process improvements are geared towards helping the E3.series users focus on creative/innovative tasks by enabling accelerated modular design, leading to cost and time savings

What’s New with Routing in the 2019 Release of CR-8000 Design Force?

Instructor: Andy Buja

Routing methodologies and best practices are continuously evolving based on new component and manufacturing technology. This class will preview the routing functionality changes planned for CR-8000 Design Force 2019. PCB designers are encouraged to attend to share their enthusiasm for new functions as well as voice their requirements for future technologies.

Zuken’s Digital Engineering Vision and an Introduction to Vitech’s MBSE Solution

Instructors: Bob Potock & Mark Malinoski

With the acquisition of Vitech Corporation, an MBSE company, Zuken is executing an E/E Digital Engineering strategy. This class will kick off our new Digital Engineering track at the conference and will begin with a discussion about Zuken’s vision for a model-based design methodology spanning the entire product life cycle. Later in the class we will introduce Vitech and their MBSE solution, GENESYS.

11:45 AM

Keynote: Opportunities & Obstacles of Creating a Connected and Collaborative Digital Thread

Instructor: Stephen Collins, Anark

Successful global manufacturers are yielding substantial performance benefits by implementing effective Digital Transformation strategies built upon modern Industry 4.0, Digital Thread/Twin, IIOT, 3D MBE, and MBSE processes and technologies to empower more effective and secure data exchange and collaboration throughout engineering, manufacturing, supply-chain and field-service operations.

Learn how these industry leaders are overcoming common obstacles to effective digitalization such as interoperability limitations, rigid legacy systems, management alignment and cultural challenges, and the need to digitalize a broad array of technical data types and formats in order to come to market faster, with higher quality products, at substantially reduced costs.

1:30 PM

Exploring Add-on Tools in E3.series
(Part 1)

Instructor: Codie Cobb

Ever look at the TOOLS folder in the E3.series installation files? Did you know it existed? This folder contains many add-on tools that are not installed automatically but are designed to further enhance the user experience, boost productivity and reduce rework. This treasure trove can provide automation options as well as enhance current workflows – from links between E3.series and all major MCAD vendors, plugins that help streamline the consumption of cable and wire data irrespective of the complexity in schematics, to revision management that ensures all changes are tracked and documented.

This two-part class will cover the most important and effective tools – both free and licensed – to enlighten the users. We will review the core functionality, top challenges these tools are designed to address and their status as free or licensed.

Redefining Simulation Using E3.series and Saber RD

Instructor: Chris Beck

We believe in working with partners across multiple domains to create a connected engineering community. Zuken’s partnership with Synopsys is geared towards bringing the best of design and simulation worlds together in a seamless workflow.

In this class you will learn about the new Frameway integration between E3.series and the latest simulation software offering from Synopsys, Saber RD. You’ll discover how Zuken and Synopsys have partnered together to offer a redesigned solution offering more robust simulation capabilities with an expanded Zuken symbol library. Details on how Zuken’s new E3.Dbe COM scripting objects were used to convert native Saber symbol data to Zuken E3.series library parts will be presented along with a live demonstration of the new Frameway.

[CASE STUDY]
Connecting the World Inside Continental with Concurrent PCB

Instructor: Mike Oswald & Sandy Jones

ECU Architecture Exploration and Optimization in a Digital Engineering Process

Instructor: Ed Duranty

As we move towards model-based design and digital engineering methodologies, the architecture definition and optimization design phase is becoming more critical. Product complexity requires decomposition into electronic control units (ECUs) and wire harnesses providing the design elements for architecture optimization. This class will look at the ECU architecture design phase using System Planner. Follow along as our expert demonstrates ECU architecture exploration and verification across function, PCB planning, mechanical fit and parametric requirements. Upon arriving on the optimal architecture, the design will seamlessly move into detailed design.

2:30 PM

Exploring Add-on Tools in E3.series
(Part 2)

Instructor: Geo Ng

Ever look at the TOOLS folder in the E3.series installation files? Did you know it existed? This folder contains many add-on tools that are not installed automatically but are designed to further enhance the user experience, boost productivity and reduce rework. This treasure trove can provide automation options as well as enhance current workflows – from links between E3.series and all major MCAD vendors, plugins that help streamline the consumption of cable and wire data irrespective of the complexity in schematics, to revision management that ensures all changes are tracked and documented.

This two-part class will cover the most important and effective tools – both free and licensed – to enlighten the users. We will review the core functionality, top challenges these tools are designed to address and their status as free or licensed.

[PARTNER]
Error-free Harnesses using Augmented Reality

Instructor: Roger Richardson, Delta-Sigma Company

Augmented reality is at the cutting edge of technology trends. The challenge though is learning how to use this amazing technology to solve real-world challenges. The manufacturing and assembly of a harness are areas that are in dire need of a productivity boost. Delta Sigma Company (DSC) and Zuken have partnered to combine the power of Zuken’s wire harness design software with DSC’s augmented reality display of harness build instructions.

This session will introduce and detail the benefits of combining two cutting-edge solutions to achieve exponentially better results. This combination of design and execution systems will provide users an unprecedented visualization of work instructions that vastly reduces build time and errors.

Best Practices for Formal Design Reuse

Instructor: Tom Warneke

Many companies are looking at the benefits of design reuse, but lack the process and tools to implement a reuse deisgn methodology. This class will present a design reuse methodology example for formal resuse. Informal resue is cut and paste, whereas formal reuse tracks where-used, version, owner and offers different usage models. Design Gateway and DS-CR will be used to demonstrate the design reuse process and benefits of formal design reuse.

Wiring System Architecture – the link between MBSE and Detail Design

Instructor: Reinhold Blank

Model based design has the potential to bring game-changing efficiency to many distributed design processes. The challenge is to ensure architecture optimization and detailed design stages are able to absorb the information of the prior phase to maximize the efficiency of the model implementation. E3.WiringSystemsLab is the way to connect the details from MBSE sources, 3D concept designs and connectivity data in an efficient easy to use tool agnostic platform.

In this class, we will look at the different stages of design with the most efficient processes to iteratively bring design concepts into the realm of detailed design. Building on the concepts from earlier, you will discover the key steps involved in optimizing physical connectivity using 3D topology and logical connectivity data while avoiding duplication of effort. In closing, we will discuss the deployment/documentation of this highly optimized design data using an equally optimized connectivity solution.

3:30 PM

[PARTNER]
From Design Directly into Production “Data2Wire”

Instructor: Tilman Hoss, Komax

How to Design a Harness by Unleashing the Power of Harness Builder for E3.series
(90 mins)

Instructor: Jonathan Dermont

A successful harness design and manufacturing process depends on intelligent solutions applied at various stages to get the desired results. The combination of E3.series and Harness Builder for E3.series aims to make all the steps in the process from quoting to manufacturing easy and efficient.

This class will present a detailed process and steps to create a complete formboard. This advanced session will journey through creating library parts, quoting, and reporting logical and detailed design. The goal is to help create a design that can be used to run test plans and create manufacturing output as well as assist with quoting and purchasing to capture a complete cycle.

New Methodologies for Module-based Multi-board Design

Instructor: Herbert Ritthaler

Electro-mobility products often consist of more than one module requiring different PCB technologies. The main module may contain the actuators and sensors which utilize a standard PCB technology but require safety standard compliance. The control and/or RF modules should be as dense as possible, while still being directly connected to the main module with a high degree of freedom at the connection point. So, the control module can be a very high density board using embedded component mounting technologies with either direct die connections, wirebond or even flipchip technology. In this class you will learn how this can be achieved with CR-8000 Design Force module design capabilities.

[PARTNER]
Empowering a Connected and Collaborative Digital Thread

Instructor: Stephen Collins, Anark

The Zuken-Anark partnership will accelerate the Zuken community’s ability to execute an E/E Digital Engineering strategy. Anark extends the Digital Engineering track discussion of model-based design methodology by introducing advanced visualization and collaboration capabilities that span the entire product life cycle.

This class introduces Anark’s ability to publish ECAD, MCAD, PLM, and ERP data into “fit-for-purpose” technical content and connected digital workflows that can be consumed on virtually any device, enabling users to collaborate more effectively and securely along the Digital Thread. It will also highlight the power of connected, web and template-based technical data exchange with “social-media” style visual collaboration. This modern replacement for conventional ad-hoc, disconnected, legacy modes of data exchange and collaboration can be applied throughout engineering, supply-chain, manufacturing and field service operations.

4:30 PM

The Wonders of Panel Design using E3.series

Instructor: Geoff Lydon

The E3.panel module was designed with the electrical engineer in mind; 2-dimensional operation containing 3-dimensional data. New to E3.series or E3.panel? This class will start with the basics of using panel design in E3.series and the best practices of using the panel design module in conjunction with E3.schematic. We will quickly move towards using the tool to create various standard panels, including control panels and rack panels.

The next steps will cover the fine-tuning of panel layouts, automated wiring options and creation of backplate drill/mill data for CNC tools. Finally, we will take a look at the library components and symbols to understand the data and intelligence associated with them. For those already using the tool, we will take a quick look at the latest capabilities that have been added to E3.panel.

How to Design a Harness by Unleashing the Power of Harness Builder for E3.series
(90 mins)

Instructor: Jonathan Dermont

A successful harness design and manufacturing process depends on intelligent solutions applied at various stages to get the desired results. The combination of E3.series and Harness Builder for E3.series aims to make all the steps in the process from quoting to manufacturing easy and efficient.

This class will present a detailed process and steps to create a complete formboard. This advanced session will journey through creating library parts, quoting, and reporting logical and detailed design. The goal is to help create a design that can be used to run test plans and create manufacturing output as well as assist with quoting and purchasing to capture a complete cycle.

Exploring the Power of Zuken’s ADM Tool

Instructor: Naoyuki Sugaya & Steve Watt

This class will introduce Zuken’s Advanced Design for Manufacturing (ADM), a DFM check tool. We will review typical use cases with CR-8000 Design Force and a third party design system. The third party design system process will show that ODB++ data is imported to Design Force, checked with ADM, and the errors are reviewed in Design Force. In addition, Participants will learn how to customize the Design Force environment to use ADM efficiently. Take-aways include demonstrating how effective ADM is as a DFM checker, the benefits of Design Force for users of other CAD tools, and knowledge of how to set up a semi-automatic checking environment using Design Force batch commands and user customization.

[PARTNER]
Digital Twins: A Multimillion Dollar Opportunity

Instructor: Steve Pytel, Ansys

04/17/19 Harness and Panel Design Harness and Panel Design PCB and IC Packaging Design PCB and IC Packaging
Design
8:00 AM

Zuken – 360

Instructor: Bob Potock

Zuken 360 is a conversation with the Zuken leadership team in a close-up and personal setting. There is no presentation or set agenda, only your questions
driving the conversation. Please join us for this highly interactive and engaging event.

9:00 AM

Intelligently Manage your Drawing Notes

Instructor: Paul Harvell

The commissioning process has always been error-prone and time-consuming. The majority of teams rely on manual paper audits to conduct and track the commissioning of equipment. Digitization of this process is an important step towards finding efficiencies and becoming a part of a robust design to the manufacturing process.

This class will walk through a commissioning process that will help effectively capture the progress as well as enable tracking, reporting and managing the updates to the designs. The ability to easily capture errors and drive the monitoring of the errors in an easy-to-use an interface is sure to increase your productivity and improve the quality of the end products.

Create a Perfect Connector Part in E3.series Library
(Part 1)

Instructor: Geo Ng

Cable, harness and system designs all feature connectors in various configurations. A connector can be the simplest passive part and yet involve details not typically evident without taking a closer look. It is important for a design solution to provide management and automation options for all the complexity a connector presents. E3.series meets and exceeds this challenge to provide robust and in-depth connector functionality.

This is a two-part class and the second part will work to dive deeper into the topics discussed in the first part including niche topics such as MIL-SPEC related functionality, cavity parts, mat sealed connectors and much more.

[PARTNER]
Polar Instruments

Instructor: Geoffrey Hazelett, Polar Instruments & Steve Watt

The Application of Artificial Intelligence in Next Generation Design Technology

Instructor: Kyle Miller

Artificial Intelligence (AI) appears in all kinds of products including phones, online retail, and autonomous vehicles. AI adds capabilities out of reach of traditional technology based on its ability to learn, improve and adapt. This Class will highlight the improvements made in PCB design technology based on the application of AI and present specific examples of the progress made in the PCB routing areas.

10:00 AM

Revolutionizing the Commissioning Process Using E3.WiringChecks

Instructor: Codie Cobb

Cable, harness and system designs all feature connectors in various configurations. A”The commissioning process has always been error-prone and time-consuming. The majority of teams rely on manual paper audits to conduct and track the commissioning of equipment. Digitization of this process is an important step towards
finding efficiencies and becoming a part of a robust design to the manufacturing process.

This class will walk through a commissioning process that will help effectively capture the progress as well as enable tracking, reporting and managing the updates to the designs. The ability to easily capture errors and drive the monitoring of the errors in an easy-to-use the interface is sure to increase your productivity and improve the quality of the end products.

Create a Perfect Connector Part in E3.series Library
(Part 2)

Instructor: Khang Nguyen

Cable, harness and system designs all feature connectors in various configurations. A connector can be the simplest passive part and yet involve details not typically evident without taking a closer look. It is important for a design solution to provide management and automation options for all the complexity a connector presents. E3.series meets and exceeds this challenge to provide robust and in-depth connector functionality.

This is a two-part class and the second part will work to dive deeper into the topics discussed in the first part including niche topics such as MIL-SPEC related functionality, cavity parts, mat sealed connectors and much more.

[PARTNER] DS-2 and PTC Windchill – The Foundation for Smart Connected Products

Instructor: Linda Mazzitelli, PTC & Shawn Larson

[PARTNER]
Next Generation Additive Electronics

Instructor: Simon Fried, Nano Dimension

11:00 AM

[PARTNER]
Utilizing E3.series Test Files on DITMCO NETS Software

Instructor: Scott Kendrick, DIT-MCO

There are a few challenges that cause more problems than the
possibility of a defective product reaching the market. The cost of recall, repairs and
support far outweigh the cost of a robust testing regime. One of the best ways to test a
a harness is by using dedicated test machines, especially when the test machines can be
driven based on your design data. The partnership between DIT-MCO and Zuken to enable
Harness Builder for E3.series to create test files that can be utilized to create and run
harness test plans is truly a time saver.

This class will detail the process of connecting the harness design from Harness Builder for E3.series to the DIT-MCO platform to automatically drive the DIT-MCO tester. We’ll explore a start-to-finish process from designing a harness to testing the end product. We will also cover details about testing machines and software available from DIT-MCO as well as their unique value to a harness development process.

[CASE STUDY]
“Where’s Waldo” Data Management in an E3.series Multi-user Environment

Instructor: Chris Blank, Applied Materials

Typical data management applications provide revision control, where-used search capabilities, design from/re-use functionality, and option control. Within a single E3.series project, these features are available. The big picture is to have these same features available across all E3.series projects in the multi-user environment, with variant and option selection features aligned to external configuration tools. In the current E3.series landscape, these data management features require customized integration, which can sometimes look like a “Where’s Waldo” puzzle. Not to worry, help is on the way in the form of Zuken’s DS-E3 application!

In this class we’ll explore
•Where-used capability in E3. seires Multi-User environment
•Design from and re-use
•Revision control, release workflow
•Variant and option management (schematic configuration)
•System schematic generation.

[CASE STUDY]
Success Stories with Intel’s Reference Platforms and Services

Instructor: Jon Downey, David Shield, Intel

[PARTNER]
Staying on Top of Your Component Data

Instructor: Tom Ruzika, SiliconExpert

12:45 PM

E3.series Tips and Tricks

Instructor: Maria Anima

There is something exciting about learning the secrets and techniques used by experts in all areas of our personal and professional lives. So, it is no surprise that E3.series Tips and Tricks has become a popular mainstay at ZIW conferences year after year.

We are taking the annual class to the next level with new powerful and dynamic methods for quickly navigating, creating and analyzing drawing within E3.series. We are also going to make it more fun by introducing more shortcuts and opportunities to test your knowledge against peers and experts.

E3.toolbox 2019 Highlights

Instructor: Sanu Warrier

New features and functions are being developed across the board to empower designers to maximize production value by expediting the creation of precise documentation. However, the challenge is to achieve our goals without spending time with customization for different use cases. E3.toolbox brings automation and streamlines the use of E3.series suites to ensure quality, accuracy, and speed are unmatched across the design tool spectrum.

The productivity boosting toolbox runs inside the standard application providing a suite of tools catering to all industries and design principles. This class will provide an overview of the functionality and introduce the new features and functions added to the new release of E3.toolbox.

CR-8000 Tips and Tricks

Instructor: Sandy Jones & Brian Gilman

This is a popular annual session where you can learn CR-8000 tips and tricks from the experts. Based on their experience, our CR-8000 experts will share a list of best practices that will save you time and improve your results.

Practical Signal Integrity for Improved EMI Control in PCB Design

Instructor: Ralf Bruening

The tight signal switching times of today’s digital systems require particular attention to the signal integrity during design to ensure reliable operation and EMI control. Super fast data rate protocols like PCIe, SATA and USB add more fuel to the fire. A PC design process just relying on impedance control and rules of thumb is not capable any linger to ensure proper operation of boards comprising DDR4 memory for example.
In this lecture, an introduction to the challenges of signal integrity and the underlying physical effects is provided. The correlation between signal integrity the EMI behavior will be discussed and practical tips to address the related challenges during PCB design is given. The lecture is amended with a practical demonstration using an FPGA-DDR4 interface structure.

1:30 PM Technology Showcase

Exhibits

Networking

Technology Showcase

Exhibits

Networking

Technology Showcase

Exhibits

Networking

Technology Showcase

Exhibits

Networking

7:00 – 10:00 PM Conference Dinner

 

For further information, please email the conference manager.

Already Registered for Zuken Innovation World 2019? Make your travel accommodations here.

For further information, please email the conference manager.

Already Registered for Zuken Innovation World 2019? Make your travel accommodations here.